(12) International Application Status Report

Received at International Bureau: 27 July 2018 (27.07.2018)

Information valid as of: 07 March 2019 (07.03.2019)

Report generated on: 18 July 2019 (18.07.2019)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2019/06622504 April 2019 (04.04.2019) Korean (KO)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/KR2018/00810618 July 2018 (18.07.2018) Korean (KO)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
10-2017-0124741 (KR)27 September 2017 (27.09.2017) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
C09J 9/02 (2006.01); C09J 7/20 (2018.01); C09J 177/00 (2006.01); C09J 11/04 (2006.01)

(71) Applicant(s):
JHC CO.LTD [KR/KR]; 313-ho, 20, Hoseo-ro 79beon-gil, Baebang-eup Asan-si Chungcheongnam-do 31499 (KR) (for all designated states)

(72) Inventor(s):
KIM, Byung Sun; 106-dong 103-ho, 260, Gwangjang-ro, Seobuk-gu Cheonan-si Chungcheongnam-do 31170 (KR)

(74) Agent(s):
KANG, Hyeong Seok; (Buldang-dong, M-Tower), 204-ho, 26, Buldang 34-gil, Seobuk-gu Cheonan-si Chungcheongnam-do 31156 (KR)

(54) Title (EN): CONDUCTIVE ADHESIVE FILM HAVING EXCELLENT HEAT RESISTANCE AND MOISTURE RESISTANCE
(54) Title (FR): FILM ADHÉSIF CONDUCTEUR PRÉSENTANT UNE REMARQUABLE RÉSISTANCE À LA CHALEUR ET UNE REMARQUABLE RÉSISTANCE À L'HUMIDITÉ
(54) Title (KO): 내열성 및 내습성이 우수한 전도성 접착 필름

(57) Abstract:
(EN): The present invention relates to a conductive adhesive film having excellent heat resistance and moisture resistance, and has an adhesive layer, which is made of a conductive adhesive composition comprising 100 parts by weight of a polyamide resin represented by chemical formula 1, 100-400 parts by weight of a conductive metal and 0.1-5 parts by weight of a siloxane compound, and is layered on the surface of a substrate, thereby improving the heat resistance of an adhesive film, facilitates curing with the siloxane compound, thereby improving moisture resistance, and has improved long-term reliability of the heat resistance and moisture resistance.
(FR): La présente invention concerne un film adhésif conducteur présentant une remarquable résistance à la chaleur et une remarquable résistance à l'humidité, et possédant une couche adhésive, qui est constituée d'une composition adhésive conductrice comprenant 100 parties en poids d'une résine de polyamide représentée par la formule chimique 1, 100 à 400 parties en poids d'un métal conducteur et 0,1 à 5 parties en poids d'un composé siloxane, et dont une couche est déposée sur la surface d'un substrat, ce qui permet d'améliorer la résistance à la chaleur d'un film adhésif, facilite le durcissement grâce au composé siloxane, améliorant ainsi la résistance à l'humidité. La fiabilité à long terme de la résistance à la chaleur et de la résistance à l'humidité est, en outre, améliorée.
(KO): 본 발명은 내열성 및 내습성이 우수한 전도성 접착 필름으로서, 화학식 1로 표시되는 폴리아미드 수지 100 중량부; 전도성 금속 100 내지 400 중량부; 실록산 화합물 0.1 내지 5 중량부;를 포함하는 전도성 접착제 조성물로 이루어진 접착층이 기재의 표면에 적층되어 접착 필름의 내열성을 향상시키며 실록산 화합물과의 경화 작용이 용이하여 내습성이 향상되되 상기 내열성 및 내습성에 대한 장기 신뢰성이 향상된 접착 필름에 관한 것이다.

International search report:
Received at International Bureau: 10 January 2019 (10.01.2019) [KR]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM