(12) International Application Status Report

Received at International Bureau: 30 July 2018 (30.07.2018)

Information valid as of: 17 January 2019 (17.01.2019)

Report generated on: 21 September 2019 (21.09.2019)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2019/03225214 February 2019 (14.02.2019) English (EN)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/US2018/04263518 July 2018 (18.07.2018) English (EN)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
15/674,883 (US)11 August 2017 (11.08.2017) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
H01L 21/677 (2006.01); H01L 21/67 (2006.01)

(71) Applicant(s):
LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, M/S CA-1 Fremont, California 94538 (US) (for all designated states)

(72) Inventor(s):
PANAGOPOULOS, Theodoros; 136 Hillbrook Drive Los Gatos, California 95032 (US)
GOULD, Richard; 4367 Torres Avenue Fremont, California 94536 (US)
REYES, Edmundo; 37332 Spruce Terrace Fremont, California 94536 (US)
BONIFACE, John; 6213 Current Drive San Jose, California 95123 (US)
BERRY, Ivan; 305 N. Via Del Circuelo Green Valley, Arizona 85614 (US)
DULKIN, Alexander; 1438 Yukon Drive Sunnyvale, California 94087 (US)
VAN SCHRAVENDIJK, Bart; 3750 Corina Way Palo Alto, California 94303 (US)

(74) Agent(s):
LEE, Michael; BEYER LAW GROUP LLP P.O. Box 51887 Palo Alto, California 94303-1887 (US)

(54) Title (EN): ULTRA-HIGH VACUUM TRANSPORT AND STORAGE
(54) Title (FR): TRANSPORT ET STOCKAGE SOUS ULTRAVIDE

(57) Abstract:
(EN): An apparatus for transporting or storing at least one semiconductor wafer in an ultra-high vacuum is provided. A portable vacuum transfer pod is provided comprising an internal wafer storage chamber for storing one or more wafers and a wafer support for supporting at least one wafer within the internal wafer storage chamber. A passively capable vacuum pump capable of passive vacuum pumping is in fluid connection with the internal wafer storage chamber and is mechanically connected to the portable vacuum transfer pod. A shut off valve for opening and closing the fluid connection is between the passively capable vacuum pump and the internal wafer storage chamber.
(FR): L'invention concerne un appareil de transport ou de stockage d'au moins une tranche de semi-conducteur sous ultravide. Une capsule de transfert sous vide transportable comprend une chambre interne de stockage de tranches permettant de stocker une ou plusieurs tranches et un support de tranches destiné à supporter au moins une tranche à l'intérieur de la chambre interne de stockage de tranches. Une pompe à vide à capacité passive permettant un pompage passif de vide est en communication fluidique avec la chambre interne de stockage de tranches et est reliée mécaniquement à la capsule de transfert sous vide transportable. Une vanne d'isolement permettant d'ouvrir et de fermer la connexion fluidique est située entre la pompe à vide à capacité passive et la chambre interne de stockage de tranches.

International search report:
Received at International Bureau: 07 November 2018 (07.11.2018) [KR]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM