(12) International Application Status Report

Received at International Bureau: 14 March 2018 (14.03.2018)

Information valid as of: 30 April 2018 (30.04.2018)

Report generated on: 25 February 2020 (25.02.2020)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2018/18017804 October 2018 (04.10.2018) Japanese (JA)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/JP2018/00782001 March 2018 (01.03.2018) Japanese (JA)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
2017-067657 (JP)30 March 2017 (30.03.2017) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
H01L 23/12 (2006.01); H01F 27/06 (2006.01); H01F 27/29 (2006.01); H01G 2/06 (2006.01); H01L 25/00 (2006.01)

(71) Applicant(s):
MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP) (for all designated states)

(72) Inventor(s):
MATSUMOTO, Sho; c/o Murata Manufacturing Co., Ltd., 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)

(74) Agent(s):
YOSHIKAWA, Shuichi; c/o NII Patent Firm, 6F, Tanaka Ito Pia Shin-Osaka Bldg., 3-10, Nishi Nakajima 5-chome, Yodogawa-ku, Osaka-city, Osaka 5320011 (JP)

(54) Title (EN): ELECTRONIC COMPONENT
(54) Title (FR): COMPOSANT ÉLECTRONIQUE
(54) Title (JA): 電子部品

(57) Abstract:
(EN): An electronic component (1) is provided with: a substrate (10) having mounting components (22, 24) that are mounted on a first main surface; a recessed section (12) that is provided in a recessed shape in a second main surface of the substrate (10), said second main surface being on the reverse side of the first main surface; an inner electrode (14) that is disposed at least on a part of the bottom surface of the recessed section (12); a plurality of outer electrodes (16) that are disposed on a part of a peripheral section (13) of the second main surface, said peripheral section excluding the recessed section (12); and a first separation section (30), i.e., an exposed peripheral section (13), between the outer electrodes (16) and the recessed section (12).
(FR): Un composant électronique (1) est pourvu : d'un substrat (10) ayant des composants de montage (22, 24) qui sont montés sur une première surface principale ; d'une section évidée (12) qui est disposée dans une forme évidée dans une seconde surface principale du substrat (10), ladite seconde surface principale étant sur le côté inverse de la première surface principale ; d'une électrode interne (14) qui est disposée au moins sur une partie de la surface inférieure de la section évidée (12) ; d'une pluralité d'électrodes externes (16) qui sont disposées sur une partie d'une section périphérique (13) de la seconde surface principale, ladite section périphérique excluant la section évidée (12) ; et d'une première section de séparation (30), à savoir, une section périphérique exposée (13), entre les électrodes externes (16) et la section évidée (12).
(JA): 電子部品(1)は、第1主面に実装部品(22)および(24)が実装される基板(10)と、基板(10)の第1主面と対向する第2主面に凹状に設けられた凹部(12)と、凹部(12)の底面の少なくとも一部に配置された内側電極(14)と、第2主面の凹部(12)以外の周辺部(13)の一部に複数配置された外側電極(16)と、外側電極(16)と凹部(12)との間に、周辺部(13)が露出した第1の分離部(30)とを備えている。

International search report:
Received at International Bureau: 30 April 2018 (30.04.2018) [JP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM