(12) International Application Status Report

Received at International Bureau: 23 November 2016 (23.11.2016)

Information valid as of: 16 May 2017 (16.05.2017)

Report generated on: 19 February 2020 (19.02.2020)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2017/09046001 June 2017 (01.06.2017) Japanese (JA)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/JP2016/08347611 November 2016 (11.11.2016) Japanese (JA)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
2015-231326 (JP)27 November 2015 (27.11.2015) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
H05K 1/14 (2006.01)

(71) Applicant(s):
SONY CORPORATION [JP/JP]; 1-7-1, Konan, Minato-ku, Tokyo 1080075 (JP) (for all designated states)

(72) Inventor(s):
NOMURA Yoshiyuki; c/o SONY EMCS CORPORATION, 1-7-1, Konan, Minato-ku, Tokyo 1080075 (JP)

(74) Agent(s):
NISHIKAWA Takashi; Nishishinjukukimuraya Building 9F, 5-25, Nishi-Shinjuku 7-chome, Shinjuku-ku, Tokyo 1600023 (JP)

(54) Title (EN): SUBSTRATE DEVICE AND METHOD FOR PRODUCING SUBSTRATE DEVICE
(54) Title (FR): DISPOSITIF DE SUBSTRAT ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF DE SUBSTRAT
(54) Title (JA): 基板装置、および基板装置の製造方法

(57) Abstract:
(EN): The present disclosure pertains to a substrate device and a method for producing the substrate device, capable of improving reliability and the produced quality of the substrate device as electronic hardware. According to the present invention, a plurality of sheet-like substrates in which wiring patterns are formed are stacked on one another to form a single-piece substrate having internal wiring, whereby two substrates are connected both physically and electrically. The disclosure is applicable to a substrate device.
(FR): La présente invention concerne un dispositif de substrat et un procédé de production du dispositif de substrat, permettant d'améliorer la fiabilité et la qualité produite du dispositif de substrat tel qu'un matériel électronique. Selon la présente invention, une pluralité de substrats stratiformes dans lesquels sont formés des motifs de câblage sont empilés l'un sur l'autre pour former un substrat monobloc comportant un câblage interne, moyennant quoi deux substrats sont reliés physiquement et connectés électriquement. L'invention est applicable à un dispositif de substrat.
(JA): 本開示は、基板装置の電子機器としての製造品質と、信頼性とを向上できるようにする基板装置、および基板装置の製造方法に関する。 配線パターンが形成されている複数のシート状の基板を積層することで、内部配線が形成された個片基板を形成し、個片基板により2枚の基板を物理的、かつ、電気的に接続する。本開示は、基板装置に適用することができる。

International search report:
Received at International Bureau: 19 December 2016 (19.12.2016) [JP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM