(12) International Application Status Report

Received at International Bureau: 06 August 2007 (06.08.2007)

Information valid as of: 23 September 2008 (23.09.2008)

Report generated on: 16 January 2021 (16.01.2021)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2007/15006627 December 2007 (27.12.2007) English (EN)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/US2007/07203825 June 2007 (25.06.2007) English (EN)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
60/816,217 (US)23 June 2006 (23.06.2006) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
H05K 1/18 (2006.01); H05K 3/20 (2006.01)

(71) Applicant(s):
UNIVERSITY OF WASHINGTON [US/US]; Campus Box 354990 4311 - 11th Avenue Northeast, Suite 500 Seattle, WA 98105-4608 (US) (for all designated states except US)
AMIRPARVIZ, Babak [IR/US]; 620 North 34th Street, Apt. #625 Seattle, WA 98103 (US) (for US only)
STAUTH, Sean [US/US]; 3624 Phinney Avenue North, Apt. #405 Seattle, WA 98103 (US) (for US only)

(72) Inventor(s):
AMIRPARVIZ, Babak; 620 North 34th Street, Apt. #625 Seattle, WA 98103 (US)
STAUTH, Sean; 3624 Phinney Avenue North, Apt. #405 Seattle, WA 98103 (US)

(74) Agent(s):
DODGE, Ryan, E.; Christensen O'Connor Johnson Kindness PLLC 1420 Fifth Avenue, Suite 2800 Seattle, WA 98101 (US)

(54) Title (EN): FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
(54) Title (FR): AUTO-ASSEMBLAGE FLUIDE POUR INTÉGRATION DE SYSTÈME

(57) Abstract:
(EN): A method for self-assembly is disclosed that accomplishes the assembly process in one step, obviating or mitigating the need for post-processing of an assembled macro- electronic device. Microcomponents are fabricated having a particular shape, and a template with embedded interconnects is fabricated having recessed binding sites that are sized to receive particular microcomponent types. The binding sites include a low melting point alloy for electrically connecting received microcomponents to the interconnect network. The template is placed in a liquid, and the microcomponents are introduced to the liquid such that the microcomponents flow or slide along the template propelled by gravity and/or fluid-dynamic forces and some of them are received into the binding sites, and retained by capillary forces. The liquid is heated before or after introduction of the microcomponents to melt the alloy. The fluid and/or template are then cooled to harden the alloy, binding the microcomponents.
(FR): La présente invention concerne un procédé d'auto-assemblage qui accomplit le procédé d'assemblage en une étape, en évitant ou atténuant la nécessité d'un post-traitement d'un dispositif macroélectronique assemblé. Des microcomposants sont fabriqués, lesquels ont une forme particulière, et un modèle avec des interconnexions noyées est fabriqué, lequel comporte des sites de liaison en retrait qui sont dimensionnés afin de recevoir des types de microcomposants particuliers. Les sites de liaison incluent un alliage à bas point de fusion afin de connecter électriquement des microcomposants reçus au réseau d'interconnexions. Le modèle est placé dans un liquide, et les microcomposants sont introduits dans le liquide de telle manière à ce que les microcomposants s'écoulent ou glissent le long du modèle propulsés par la gravité et/ou des forces à dynamique de fluide et certains d'entre eux sont reçus dans des sites de liaison, et retenus par des forces capillaires. Le liquide est chauffé avant ou après l'introduction des microcomposants pour faire fondre l'alliage. Le fluide et/ou le modèle sont ensuite refroidis afin de durcir l'alliage liant les microcomposants.

International search report:
Received at International Bureau: 20 November 2007 (20.11.2007) [KR]

International Report on Patentability (IPRP) Chapter II of the PCT:
Chapter II demand received: 21 April 2008 (21.04.2008)

(81) Designated States:
AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, MD, RU, TJ, TM