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1. (WO2018131191) LOW MELTING POINT SEALING MATERIAL, ELECTRONIC COMPONENT, AND SEALING BODY

Pub. No.:    WO/2018/131191    International Application No.:    PCT/JP2017/024434
Publication Date: Fri Jul 20 01:59:59 CEST 2018 International Filing Date: Wed Jul 05 01:59:59 CEST 2017
IPC: C03C 8/24
C03C 3/23
C03C 8/06
C03C 8/08
Applicants: NIHON YAMAMURA GLASS CO., LTD.
日本山村硝子株式会社
Inventors: IKEDA, Takuro
池田 拓朗
Title: LOW MELTING POINT SEALING MATERIAL, ELECTRONIC COMPONENT, AND SEALING BODY
Abstract:
Provided is a sealing material applicable to a surface comprising an inorganic oxide and/or metal, that can be well spread after heat treatment in a low temperature range, can be suitably sealed by cooling and solidification, and has excellent performance maintenance under low temperature cooling conditions. This sealing material is a low melting point sealing material comprising 50%–100% by volume of a low melting point composition and 0%–50% by volume filler. The low melting point composition comprises Ag, I, and O as essential constituent elements thereof, has cations and anions bonded therein, and when represented as an aggregation of a variety of compounds indicated by formula MQm/q (M indicating a cation having a valence m and Q indicating an anion having a valence q] and as having all anions other than oxide anions (O2-) being bonded with Ag ions, the ratios of each fulfill the following conditions: AgI: 40–85 mol%; AGO1/2: 10–50 mol%; AgO1/2 + AgI: 65–95 mol%; and AgI/AgO1/2 ≥ 1 (mol/mol). The low melting point composition contains at least one type selected from VO5/2, MoO3, WO3, MnO2, ZnO, BO3/2, GeO2, PbO, PO5/2, SbO5/2, BiO3/2, and TeO2in a total amount of 5–35 mol%.