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1. (WO2018111268) MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
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CLAIMS

What is claimed is:

1. A microelectronic device comprising:

a first substrate having radio frequency (RF) components;

a second substrate coupled to the first substrate, the second substrate including a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher; and

a mold material disposed on the first and second substrates, the mold material including a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

2. The microelectronic device of claim 1, wherein the mold material includes a first thickness for the first region that is associated with the antenna unit and a second thickness for a second region that is associated with the first substrate.

3. The microelectronic device of claim 2, wherein the first thickness is less than approximately 300 microns and the second thickness is less than approximately 150 microns.

4. The microelectronic device of claim 2, wherein the second thickness for the second region that is associated with the first substrate is designed to expose an upper surface of the first substrate for enhanced thermal management of the first substrate.

5. The microelectronic device of claim 1, further comprising:

a through mold conductive connection that is coupled to the first conductive layer of the antenna unit, wherein the first and second conductive layers of the antenna unit form a stacked patch antenna that is integrated with the second substrate.

6. The microelectronic device of claim 5, wherein the second substrate comprises an organic package substrate having conductive layers and organic dielectric layers.

7. The microelectronic device of claim 1, wherein the microelectronic device further comprises an additional antenna unit with each antenna unit being connected to at least one RF component including at least one transceiver die to form a phased array antenna module of a 5G package architecture for 5G communications.

8. A microelectronic device comprising:

a first substrate having radio frequency (RF) components;

a second substrate coupled to the first substrate, the second substrate including conductive layers and organic dielectric layers;

a mold material disposed on the first and second substrates; and

an electromagnetic interference (EMI) shield integrated with the mold material to shield the RF components from EMI.

9. The microelectronic device of claim 8, wherein the second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher and the mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

10. The microelectronic device of claim 9, wherein the first substrate comprises a die and the mold material includes a second region that is positioned between the EMI shield and an upper surface of the die.

11. The microelectronic device of claim 9, wherein the first and second conductive layers of the antenna unit form a stacked patch antenna that is integrated with the second substrate.

12. The microelectronic device of claim 8, wherein the first substrate comprises a die and the EMI shield is positioned in close proximity to an upper surface of the die.

13. The microelectronic device of claim 9, further comprising:

through mold conductive connections for electrically coupling the EMI shield to a conductive ground layer within the second substrate.

14. The microelectronic device of claim 8, wherein the microelectronic device comprises a 5G package architecture for 5G communications.

15. A computing device comprising:

at least one processor to process data; and

a communication module or chip coupled to the at least one processor, the communication module or chip comprises,

a first substrate having radio frequency (RF) components,

a second substrate coupled to the first substrate, the second substrate including a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 15 GHz or higher; and

a mold material disposed on the first and second substrates, the mold material including a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

16. The computing device of claim 15, wherein the mold material includes a first thickness for the first region that is associated with the antenna unit and a second thickness for a second region that is associated with the first substrate.

17. The computing device of claim 16, wherein the first thickness is less than approximately 300 microns and the second thickness is less than approximately 150 microns.

18. The computing device of claim 16, wherein the second thickness for the second region that is associated with the first substrate is designed to expose an upper surface of the first substrate for enhanced thermal management of the first substrate.

19. The computing device of claim 15, wherein the first and second conductive layers of the antenna unit form a stacked patch antenna that is integrated with the second substrate.

20. The computing device of claim 15, wherein the second substrate comprises an organic package substrate having conductive layers and organic dielectric layers, wherein the microelectronic device comprises a 5G package architecture for 5G communications.