The present invention provides an antenna package 100 and a manufacturing method thereof. The antenna package 100 comprises an antenna 101 with an embedded antenna port 102. The antenna 101 has an antenna port side and an antenna radiation side. A semiconductor chip 103 is provided on the antenna port side of the antenna 101. The chip 103 comprises coupling elements for coupling radio frequency signals from a top side of the chip 103 to the antenna port 102. These coupling elements comprise a matching network including a high-impedance microstrip line 104 and a ground window 105 on the top side of the chip 103, a resonant dielectric cavity 106 within the chip 103, and a metal coupling slot 107 facing the antenna port 102 on a bottom side of the chip 103.