Suche in nationalen und internationalen Patentsammlungen

1. (WO2016005068) PROCESS FOR THE MANUFACTURE OF A THICK COPPER WIRE FOR BONDING APPLICATIONS

Pub. No.:    WO/2016/005068    International Application No.:    PCT/EP2015/059183
Publication Date: Fri Jan 15 00:59:59 CET 2016 International Filing Date: Wed Apr 29 01:59:59 CEST 2015
IPC: H01L 23/49
C22C 9/00
C22F 1/08
H01B 1/02
Applicants: HERAEUS DEUTSCHLAND GMBH & CO. KG
Inventors: MILKE, Eugen
AINOUZ, Larbi
PRENOSIL, Peter
Title: PROCESS FOR THE MANUFACTURE OF A THICK COPPER WIRE FOR BONDING APPLICATIONS
Abstract:
A process for the manufacture of a bonding wire comprising a core with a surface, wherein the core comprises ≥ 98.0% copper and has a cross sectional area in the range of 7500 to 600000 μm2 and an elastic limit RP0.2 (yield strength) in the range of 40 to 95 N/mm2, the process comprising the steps of: a) providing a copper core precursor; b) drawing the precursor until a final diameter of the wire core is reached; c) annealing the drawn wire at a minimum annealing temperature in the range of 650 to 1000 °C through its entire cross section for a minimum annealing time in the range of 4 seconds to 2 hours.