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1. (WO2014085846) METHOD OF FORMING SEAMLESS PIPE OF TITANIUM AND/OR TITANIUM ALLOYS
Anmerkung: Text basiert auf automatischer optischer Zeichenerkennung (OCR). Verwenden Sie bitte aus rechtlichen Gründen die PDF-Version.

CLAIMS :

1. A method of forming sections of seamless titanium or titanium alloy pipe, the method comprising the steps of:

providing a substrate for forming pipe and a sleeve of a section of pipe on the substrate, the pipe section having an end from which the substrate projects ;

spraying particles of titanium or titanium alloy generally parallel to a longitudinal axis of the substrate to impact a face of the end and to cause particles to bond to and to accumulate on the pipe end to form pipe; and

(c) moving formed pipe longitudinally relative to the substrate to remove formed pipe from the pipe- forming substrate and continuing to spray titanium or titanium alloy particles onto the end face to cause further pipe to form continuously and integrally with the formed pipe, thereby enabling formation of a seamless titanium or titanium alloy pipe of a desired length.

The method defined in claim 1, wherein step (c) comprises a step of applying a compressive force the end face of the pipe.

3. The method defined in claim 2, wherein the

compressive force is applied to accumulated particles on the end face by a fixed roller, whereby growth of the titanium alloy pipe causes longitudinal movement of formed pipe relative to the substrate.

The method defined in any one of claims 1 to 3, wherein step (b) involves evenly distributing sprayed particles over the face to cause even growth of the formed pipe by rotating the substrate and pipe relative to the particle spray.

The method defined in claim 4, wherein step (b) involves spraying particles onto the end face via a plurality of spray nozzles.

The method defined in any one of the preceding claims, wherein the method further comprises

compressing formed pipe to reduce porosity of the formed pipe.

The method defined in claim 6, wherein the

compressive force is applied to an outwardly facing curved surface of the pipe.

8. The method defined in claim 2 or claim 6, the step of compressing the pipe includes controlling the

compressive force.

The method defined in claim 8, wherein compressive force is controlled by controlling friction between the substrate and the formed pipe or the pipe section or by applying a load on the pipe opposite to the compressive load.

10. The method defined in claim 9, wherein controlling the friction comprises selecting a substrate to provide sufficient friction to longitudinal movement of the formed pipe so that the compressive force applied by the roller causes compression of

accumulated particles.

The method defined in claim 10, wherein controlling friction involves controlling the extent of bonding between formed titanium or titanium alloy pipe and the substrate to enable formed pipe to be moved relative to the substrate.

The method defined in claim 11, wherein the extent of bonding is controlled by heating the formed titanium or titanium alloy pipe or by cooling the substrate to cause differential thermal expansion of the formed pipe relative to the substrate, thereby releasing the formed pipe from the pipe forming substrate and enabling the formed pipe to be moved relative to the substrate. The thermal differential may be caused preferentially by heating the formed titanium or titanium alloy pipe . Alternatively, the thermal differential may be caused by cooling the substrate causing a thermal differential between the formed pipe and the pipe forming substrate relative to the pipe.

The method defined in claim 11, wherein the method involves controlling the extent of bonding by

selecting a substrate having a co-efficient of thermal expansion that is less than the co-efficient of thermal expansion of the titanium or titanium alloy.

The method defined in claim 11, wherein the method involves controlling the extent of bonding by

selecting a substrate having a particular surface roughness .

The method defined in claim 14, wherein the average surface roughness of the substrate is Ra < l.Opm.

The method defined in claim 11, wherein the substrate is formed of a material that is selected based on its potential for bonding chemically with titanium or titanium alloy.

A titanium or titanium alloy pipe formed in

accordance with the continuous forming method defined in any one of claim 1 to 16.

The titanium or titanium alloy pipe defined in claim 17, wherein the pipe has a composition comprising:

titanium: 99.8 wt% ; and

the balance comprising incidental impurities.

The titanium or titanium alloy pipe defined in claim 17, wherein the pipe has a composition comprising:

titanium: 90 to 94 wt% ; and

aluminium and vanadium: 6 to 10 wt% ; and

the balance comprising incidental impurities.

An apparatus for spray-forming pipe in accordance with the method defined in any one of claims 1 to 16, wherein the apparatus comprises:

(a) a substrate for forming pipe, the substrate being fitted with a sleeve of a section of pipe having an end face;

(b) means for rotating the substrate and pipe section about a longitudinal axis of the substrate; and

(c) means for cold-spraying particles of titanium or titanium alloy generally parallel to the

longitudinal axis to impact the end face and to form seamless pipe.

The apparatus defined in claim 20, wherein the apparatus further comprises compression means for applying a compressive force to the end face to compress particles that accumulate on the end face and to cause longitudinal movement of the formed seamless pipe relative to the substrate.

The apparatus defined in claim 21, wherein the substrate is selected to provide sufficient friction to cause compression of accumulated particles by the compression means and to cause the longitudinal movement of the formed pipe relative to the

substrate .

The apparatus defined in any one of claims 20 to 22, wherein the apparatus further comprises means for applying a compressive force to the formed pipe in a radial direction with respect to the direction of rotation of the substrate.