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1. (WO2013162475) A PACKAGING APPARATUS AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING

Pub. No.:    WO/2013/162475    International Application No.:    PCT/SG2013/000167
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Fri Apr 26 01:59:59 CEST 2013
IPC: H01L 21/67
Applicants: UST TECHNOLOGY PTE. LTD.
Inventors: TAN, Meng Yeow
NG, Chin Sin
CHANG, Sing Keong
Title: A PACKAGING APPARATUS AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING
Abstract:
A packaging apparatus and method for transferring integrated circuits to a packaging, the apparatus comprising: a carrier for carrying a plurality of integrated circuits and moving the integrated circuits between a location of the first packaging and a first location, the first packaging being configured for holding a plurality of integrated circuits; a first plurality of transfer units, the first plurality of transfer units being configured for transferring one or more integrated circuits from the first packaging to the carrier; and a second plurality of transfer units, the second plurality of transfer units being configured for transferring one or more integrated circuits from the carrier in the first location to one or more respective holders in a second packaging, said carrier comprising a plurality of seats for receiving integrated circuits, said carrier being configured for adjusting each received integrated circuit to assume an orientation if misalignment from the orientation occurs.