In Bearbeitung

Bitte warten ...

Einstellungen

Einstellungen

Gehe zu Anmeldung

1. WO2010057770 - FORMULIERUNGEN ENTHALTEND EIN GEMISCH VON ZNO-CUBANEN UND SIE EINSETZENDES VERFAHREN ZUR HERSTELLUNG HALBLEITENDER ZNO-SCHICHTEN

Veröffentlichungsnummer WO/2010/057770
Veröffentlichungsdatum 27.05.2010
Internationales Aktenzeichen PCT/EP2009/064584
Internationales Anmeldedatum 04.11.2009
IPC
C23C 18/12 2006.1
CSektion C Chemie; Hüttenwesen
23Beschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Chemische Oberflächenbehandlung; Diffusionsbehandlung von metallischen Werkstoffen; Beschichten allgemein durch Vakuumbedampfen, Aufstäuben, Ionenimplantation oder chemisches Abscheiden aus der Dampfphase; Inhibieren von Korrosion metallischer Werkstoffe oder von Verkrustung allgemein
CBeschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Oberflächenbehandlung metallischer Werkstoffe durch Diffusion in die Oberfläche, durch chemische Umwandlung oder Substitution; Beschichten allgemein durch Vakuumbedampfen, durch Aufstäuben, durch Ionenimplantation oder durch chemisches Abscheiden aus der Dampfphase
18Chemisches Beschichten durch Zersetzen entweder flüssiger Verbindungen oder der Lösungen der den Überzug bildenden Verbindungen ohne Verbleiben von Reaktionsprodukten des Oberflächenmaterials im Überzug; Kontaktbeschichten
02durch thermische Zersetzung
12gekennzeichnet durch das Abscheiden anderer anorganischer Stoffe als metallischer Stoffe
C07F 3/06 2006.1
CSektion C Chemie; Hüttenwesen
07Organische Chemie
FAcyclische, carbocyclische oder heterocyclische Verbindungen, die andere Elemente als Kohlenstoff, Wasserstoff, Halogen, Sauerstoff, Stickstoff, Schwefel, Selen oder Tellur enthalten
3Verbindungen, die Elemente der Gruppen 2 oder 12 des Periodensystems enthalten
06Zinkverbindungen
CPC
C23C 16/06
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
06characterised by the deposition of metallic material
C23C 18/1216
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
1204inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
1208Oxides, e.g. ceramics
1216Metal oxides
C23C 18/122
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
1204inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
122Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
C23C 18/1233
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
1229Composition of the substrate
1233Organic substrates
C23C 18/1245
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
1229Composition of the substrate
1245Inorganic substrates other than metallic
C23C 18/1295
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
125Process of deposition of the inorganic material
1295with after-treatment of the deposited inorganic material
Anmelder
  • EVONIK DEGUSSA GMBH [DE]/[DE] (AllExceptUS)
  • THIEM, Heiko [DE]/[DE] (UsOnly)
  • STEIGER, Jürgen [DE]/[DE] (UsOnly)
  • MERKULOV, Alexey [RU]/[DE] (UsOnly)
  • PHAM, Duy Vu [DE]/[DE] (UsOnly)
  • AKSU, Yilmaz [TR]/[DE] (UsOnly)
  • SCHUTTE, Stefan [DE]/[DE] (UsOnly)
  • DRIESS, Matthias [DE]/[DE] (UsOnly)
Erfinder
  • THIEM, Heiko
  • STEIGER, Jürgen
  • MERKULOV, Alexey
  • PHAM, Duy Vu
  • AKSU, Yilmaz
  • SCHUTTE, Stefan
  • DRIESS, Matthias
Prioritätsdaten
10 2008 058 040.618.11.2008DE
Veröffentlichungssprache Deutsch (de)
Anmeldesprache Deutsch (DE)
Designierte Staaten
Titel
(DE) FORMULIERUNGEN ENTHALTEND EIN GEMISCH VON ZNO-CUBANEN UND SIE EINSETZENDES VERFAHREN ZUR HERSTELLUNG HALBLEITENDER ZNO-SCHICHTEN
(EN) FORMULATIONS CONTAINING A MIXTURE OF ZNO CUBANES AND METHOD FOR PRODUCING SEMICONDUCTING ZNO LAYERS USING SAID FORMULATIONS
(FR) FORMULATIONS CONTENANT UN MÉLANGE DE CUBANES DE ZNO, ET PROCÉDÉ LES UTILISANT POUR LA PRÉPARATION DE COUCHES DE ZNO SEMI-CONDUCTRICES
Zusammenfassung
(DE) Die vorliegende Erfindung betrifft Formulierungen umfassend a) mindestens zwei verschiedene ZnO-Cubane von denenmindestens ein ZnO-Cuban bei SATP-Bedingungen fest vorliegt und mindestens ein ZnO-Cuban bei SATP-Bedingungen flssig vorliegt, undb) mindestens ein Lsemittel, Verfahren zur Herstellung halbleitender ZnO-Schichten aus diesen Formulierungen, die Verwendung der Formulierungen zur Herstellung elektronischer Bauteile sowie die elektronischen Bauteile selbst.
(EN) The present invention relates to formulations comprising a) at least two different ZnO cubanes, of which at least one ZnO cubane is solid at SATP conditions and at least one ZnO cubane is liquid at SATP conditions, and b) at least one solvent, method for producing semiconducting ZnO layers from said formulations, the use of the formulations to produce electronic components, and the electronic components themselves.
(FR) La présente invention porte sur des formulations comprenant a) au moins deux cubanes de ZnO différents, parmi lesquels au moins un cubane de ZnO est solide dans les conditions SATP (conditions de température et de pression ambiantes normales), et au moins un cubane de ZnO se présente sous forme liquide dans les conditions SATP, et b) au moins un solvant. L'invention porte également sur un procédé pour la préparation de couches de ZnO semi-conductrices à partir de ces formulations, sur l'utilisation des formulations pour la fabrication de composants électroniques, ainsi que sur les composants électroniques proprement dits.
Aktuellste beim Internationalen Büro vorliegende bibliographische Daten