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A method of pulsed bipolar sputtering including applying a sputtering pulse (−) during a first period of time (T−) and applying a revers voltage pulse during a subsequent second period of time (T+). The step of applying the revers voltage pulse comprises controlling, in particular adjusting, the timing of the revers voltage pulse (T+). This way high quality sputtering is achieved, in particular for sputtering temperature sensitive materials.