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1. RU0002419662 - WIRE FOR MICRO-WELDING

Amt Russische Föderation
Aktenzeichen/Anmeldenummer 2008136871/02
Anmeldedatum 13.02.2007
Veröffentlichungsnummer 0002419662
Veröffentlichungsdatum 27.05.2011
Erteilungsnummer
Erteilungsdatum 27.05.2011
Veröffentlichungsart C2
IPC
H01L 23/49
HElektrotechnik
01Grundlegende elektrische Bauteile
LHalbleiterbauelemente; elektrische Festkörperbauelemente, soweit nicht anderweitig vorgesehen
23Einzelheiten von Halbleiter- oder anderen Festkörperbauelementen
48Anordnungen zur Stromleitung zu oder von dem im Betrieb befindlichen Festkörper, z.B. Zuleitungen oder Anschlüsse
488bestehend aus gelöteten oder gebondeten Anordnungen
49drahtförmig
C22C 5/02
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
5Legierungen auf der Basis von Edelmetallen
02Legierungen auf der Basis von Gold
C22C 1/02
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
1Herstellen von Nichteisen-Legierungen
02durch Schmelzen
CPC
C22C 5/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
02Alloys based on gold
C22C 1/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making alloys
02by melting
H01L 24/45
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
H01L2224/45015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45015being circular
H01L2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L2924/00014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Erfinder БИШОФФ Альбрехт (DE)
ШРЕПЛЕР Лутц (DE)
ЦИНГГ Хольгер (DE)
BIShOFF Al'brekht (DE)
ShREPLER Lutts (DE)
TsINGG Khol'ger (DE)
Prioritätsdaten 102006006782.2 13.02.2006 DE
Titel
(EN) WIRE FOR MICRO-WELDING
(RU) ПРОВОЛОКА ДЛЯ МИКРОСВАРКИ
Zusammenfassung
(EN)
FIELD: metallurgy. SUBSTANCE: alloy on base of gold contains 99.9 of wt % of gold and 1-1000 parts per million, in particular, 10-100 parts per million of calcium, 1-1000 of part per million, in particular, 10-100 parts per million of ytterbium and/or europium, 1-100 parts per million of misch metal of cerium and 1-10 parts per million of beryllium. Also, alloy is crystallised in form of solid solution. The procedure for production of alloy on base of gold consists in melting uniform addition alloy in vacuum. This addition alloy contains calcium, ytterbium and/or europium. Addition alloy is introduced into gold with addition of calcium, europium and/or ytterbium, if necessary, till there is produced additional alloy with gold as a basic component, which is further introduced to gold melt together with another additional alloy containing gold as a basic component and alloying additives of beryllium Be and misch metal of cerium Ce. EFFECT: production of alloy of high strength at maintaining properties of gold - inertness and high conductivity. 4 cl, 2 dwg, 1 ex

(RU)
Изобретение относится к области металлургии, в частности к сплавам на основе золота и получению из них проволоки для микросварки. Сплав на основе золота содержит 99,9 весовых % золота и 1-1000 частей на миллион, в частности 10-100 частей на миллион кальция, 1-1000 частей на миллион, в частности 10-100 частей на миллион иттербия и/или европия, 1-100 частей на миллион мишметалла церия и 1-10 частей на миллион бериллия, при этом сплав закристаллизован в виде твердого раствора. Способ получения сплава на основе золота включает выплавление в вакууме однородной лигатуры, содержащей кальций, иттербий и/или европий, введение ее в золото, при необходимости с добавлением кальция, европия и/или иттербия, до получения лигатуры с золотом в качестве основного компонента, которую затем вводят в расплав золота совместно с другой лигатурой, содержащей золото в качестве основного компонента и легирующие добавки бериллия Be и мишметалла церия Се. Технический результат - получение сплава, характеризующегося высокой прочностью с сохранением свойств золота - инертности и высокой проводимости. 3 н. и 1 з.п.ф-лы, 2 ил.

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