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1. KR1020080094909 - BONDING WIRE

Amt Republik Korea
Aktenzeichen/Anmeldenummer 1020087019780
Anmeldedatum 12.08.2008
Veröffentlichungsnummer 1020080094909
Veröffentlichungsdatum 27.10.2008
Veröffentlichungsart A
IPC
C22C 5/02
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
5Legierungen auf der Basis von Edelmetallen
02Legierungen auf der Basis von Gold
C22C 5/00
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
5Legierungen auf der Basis von Edelmetallen
CPC
C22C 5/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
02Alloys based on gold
C22C 1/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making alloys
02by melting
H01L 24/45
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
H01L2224/45015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45015being circular
H01L2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L2924/00014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Anmelder W.C. HERAEUS GMBH
Erfinder BISCHOFF ALBRECHT
SCHRAEPLER LUTZ
ZINGG HOLGER
Prioritätsdaten 2006 1006006782 13.02.2006 DE
Titel
(EN) BONDING WIRE
Zusammenfassung
(EN)
The invention relates to a gold alloy, containing 99% by weight, in particular 99.9% by weight, gold and 1 to 1000 ppm, in particular 10 to 100 ppm, calcium, and 1 to 1000 ppm, in particular 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, and to a method for producing a homogeneous gold alloy containing europium and/or ytterbium. ©KIPO&WIPO 2009

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