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1. JP2018139317 - COMPONENT CARRIER AND COMPONENT CARRIER ASSEMBLY

Amt
Japan
Aktenzeichen/Anmeldenummer 2018093237
Anmeldedatum 14.05.2018
Veröffentlichungsnummer 2018139317
Veröffentlichungsdatum 06.09.2018
Veröffentlichungsart A5
IPC
H01L 23/12
HSektion H Elektrotechnik
01Grundlegende elektrische Bauteile
LHalbleiterbauelemente; elektrische Festkörperbauelemente, soweit nicht anderweitig vorgesehen
23Einzelheiten von Halbleiterbauelementen oder anderen Festkörperbauelementen
12Montagesockel, z.B. nicht lösbare isolierende Substrate
H01L 23/36
HSektion H Elektrotechnik
01Grundlegende elektrische Bauteile
LHalbleiterbauelemente; elektrische Festkörperbauelemente, soweit nicht anderweitig vorgesehen
23Einzelheiten von Halbleiterbauelementen oder anderen Festkörperbauelementen
34Anordnungen zum Kühlen, Heizen, Belüften oder zur Temperaturkompensation
36Auswahl des Materials oder der Form, um die Kühlung oder Heizung zu erleichtern, z.B. Wärmesenken
CPC
H01L 33/642
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
642characterized by the shape
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
H05K 1/0207
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0207using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
H05K 1/0306
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0306Inorganic insulating substrates, e.g. ceramic, glass
H05K 3/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
0061onto a metallic substrate, e.g. a heat sink
Anmelder EPCOS AG
ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト
Erfinder THOMAS FEICHTINGER
ファイヒティンガー、トーマス
AXEL PECINA
ペチナ、アクセル
Vertreter 木村 満
毛受 隆典
森川 泰司
桜田 圭
美恵 英樹
Prioritätsdaten 102012113014 21.12.2012 DE
Titel
(EN) COMPONENT CARRIER AND COMPONENT CARRIER ASSEMBLY
(JA) コンポーネントキャリア及びコンポーネントキャリアアセンブリ
Zusammenfassung
(EN)

PROBLEM TO BE SOLVED: To provide a component carrier and a component carrier assembly that enable a good heat dissipation.

SOLUTION: A component carrier 10 comprises a multilayer carrier body 15 having a substrate 3 containing a structured functional region 2. The substrate 3 extends laterally and also at least partly above and below the functional region 2, and/or the substrate extends laterally and also completely above and below the functional region 2, and/or the substrate is arranged in the functional region 2 or in a manner projecting therein.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2018,JPO&INPIT


(JA)

【課題】良好な熱放散を可能にするコンポーネントキャリア及びコンポーネントキャリアアセンブリを提供する。
【解決手段】コンポーネントキャリア10は、基板3を含む多層キャリア本体15を有する。構造化された機能領域2が存在し、基板3は、横方向並びに少なくとも部分的に機能領域2の上方及び下方及び/又は横方向並びに全体的に機能領域2の上方及び下方及び/又は機能領域2の内部にあるかまたは突出するようにその内部に配置されている。
【選択図】図1