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1. CN101384738 - Bonding wire

Amt China
Aktenzeichen/Anmeldenummer 200780005294.5
Anmeldedatum 13.02.2007
Veröffentlichungsnummer 101384738
Veröffentlichungsdatum 11.03.2009
Veröffentlichungsart A
IPC
C22C 5/02
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
5Legierungen auf der Basis von Edelmetallen
02Legierungen auf der Basis von Gold
C22C 1/02
CChemie; Hüttenwesen
22Metallhüttenwesen; Eisen- oder Nichteisenlegierungen; Behandlung von Legierungen oder von Nichteisenmetallen
CLegierungen
1Herstellen von Nichteisen-Legierungen
02durch Schmelzen
H01L 23/49
HElektrotechnik
01Grundlegende elektrische Bauteile
LHalbleiterbauelemente; elektrische Festkörperbauelemente, soweit nicht anderweitig vorgesehen
23Einzelheiten von Halbleiter- oder anderen Festkörperbauelementen
48Anordnungen zur Stromleitung zu oder von dem im Betrieb befindlichen Festkörper, z.B. Zuleitungen oder Anschlüsse
488bestehend aus gelöteten oder gebondeten Anordnungen
49drahtförmig
CPC
C22C 5/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
02Alloys based on gold
C22C 1/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making alloys
02by melting
H01L 24/45
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
H01L 2224/45015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45015being circular
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2924/00011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Anmelder Heraeus GmbH W. C.
W.C.贺利氏有限公司
Erfinder Bischoff Albrecht
阿尔布雷希特·比朔夫
Schraepler Lutz
卢茨·施雷普勒
Zingg Holger
霍尔格·青格
Vertreter ding yebeng zhang tianshu
北京天昊联合知识产权代理有限公司
北京天昊联合知识产权代理有限公司
Prioritätsdaten 102006006782.2 13.02.2006 DE
Titel
(EN) Bonding wire
(ZH) 接合线
Zusammenfassung
(EN)
The invention relates to a gold-based alloy, containing 99 weight percent, preferably 99.9 weight percent of gold; 1ppm to 1000ppm, preferably 10ppm to 100ppm of calcium; and 1ppm to 1000ppm, preferably 10ppm to 100ppm of ytterbium, europium, or a mixture of ytterbium and europium. The invention also relates to a method for manufacturing homogeneous phase gold-based alloy containing europium and/or ytterbium.

(ZH)

本发明涉及一种金基合金,所述金基合金含有:99重量%、优选99.9重量%的金,1ppm至1000ppm、优选10ppm至100ppm的钙,以及1ppm至1000ppm、优选10ppm至100ppm的镱或者铕或者由镱和铕构成的混合物,本发明还涉及含有铕和/或镱的均相金基合金的制备方法。

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