(EN)
The invention relates to a heat sink comprised of a diamond-containing composite material. In addition to having a diamond proportion of 40 to 90 % by volume, the composite material contains 0.005 to 12 % by volume of a silicon carbon compound, 7 to 49 % by weight of an Ag-rich, Au-rich or Al-rich phase, and less than 5 % by volume of another phase, whereby the volume ratio of the Ag-rich, Au-rich or Al-rich phase to silicon carbide is greater than 4, and at least 60 % of the surface of the diamond is covered by the silicon carbon compound. Preferred production methods involve pressureless and pressure-assisted infiltration techniques. This part is suited for use, in particular, as a heat sink for semiconductor components.
(ZH) 本发明涉及一种由含有金刚石复合材料制成的受热器。除了40～90体积%的金刚石含量以外，该复合材料还包含0.005～12体积%的硅-碳化合物，7～49体积%的Ag-，Au-或Al-富集相和低于5体积%的其它相，Ag-，Au-或Al-富集相对碳化硅的体积比大于4，至少60%的金刚石表面被硅-碳化合物所覆盖。优选的制造工艺包括大气压和压力帮助的渗透技术。该部件特别适合作为半导体元件的受热器。