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1. CN1205661 - High speed rotating tool

Amt China
Aktenzeichen/Anmeldenummer 96199273.5
Anmeldedatum 22.10.1996
Veröffentlichungsnummer 1205661
Veröffentlichungsdatum 20.01.1999
Veröffentlichungsart A
IPC
B23C 5/00
BArbeitsverfahren; Transportieren
23Werkzeugmaschinen; Metallbearbeitung, soweit nicht anderweitig vorgesehen
CFräsen
5Fräswerkzeuge
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 2924/16195
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
161Cap
1615Shape
16195Flat cap [not enclosing an internal cavity]
Anmelder kennametal Inc.
钴碳化钨硬质合金公司
Erfinder Timothy R. Feldsine
蒂莫西·R·费尔德西内
Vertreter yi yongmei
中国国际贸易促进委员会专利商标事务所
Prioritätsdaten 08577164 22.12.1995 US
Titel
(EN) High speed rotating tool
(ZH) 高速旋转刀具
Zusammenfassung
(EN)
A rotating tool (10) mateable with the spindle of a machine tool for high speed rotation is disclosed. The tool is comprised of a shank (12) and a disk (14). The disk (14) has attached to its periphery cutting inserts (20). These inserts (20) may be attached directly to recesses in the disk or to lugs (22) protruding from the disk (14). If the inserts are attached to lugs (22), then the disk (14) will further have opposing counterweight lugs (24) protruding from the disk (14) in an opposite direction. A band (34) of high tenacity material extends around the disk (14) to restrain radial expansion. Additionally, the disk (14) may be encompassed in a restraining material to restrain any disk parts that may separate from the disk body.

(ZH)

本文披露了一种可与机床主轴配合以便高速旋转的旋转刀具(10)。此刀具是由圆盘(14)和刀柄(12)构成的。在圆盘(14)的周边上固定有切削镶齿(20)。这些镶齿(20)可直接固定在圆盘上的凹槽中或固定在从圆盘(14)凸起的凸缘(22)上。如果镶齿被固定在凸缘(22)上,则圆盘(14)还将具有从圆盘(14)沿反向凸起的对置的平衡凸缘(24)。一条由高韧性材料制成的箍圈(34)环绕圆盘(14)以限制径向膨胀。另外,圆盘(14)可能被包裹在限制材料中以约束任何可能脱离圆盘体的圆盘部分。