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1. CN108029208 - MEDIA-TIGHT CONTROL DEVICE FOR A MOTOR VEHICLE AND METHOD FOR PRODUCING THE CONTROL DEVICE

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Amt
China
Aktenzeichen/Anmeldenummer 201680050585.5
Anmeldedatum 16.08.2016
Veröffentlichungsnummer 108029208
Veröffentlichungsdatum 11.05.2018
Erteilungsnummer 108029208
Erteilungsdatum 30.10.2020
Veröffentlichungsart B
IPC
H05K 5/00
HSektion H Elektrotechnik
05Elektrotechnik, soweit nicht anderweitig vorgesehen
KGedruckte Schaltungen; Gehäuse oder bauliche Einzelheiten von elektrischen Geräten; Herstellung von Baugruppen aus elektrischen Elementen
5Gehäuse, Schränke oder Einschübe für elektrische Geräte
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2924/181
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
181Encapsulation
H01L 2924/19107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19107off-chip wires
H05K 5/0082
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
0026provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
0082specially adapted for transmission control units, e.g. gearbox controllers
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
Anmelder CONTI TEMIC MICROELECTRONIC GMBH
大陆泰密克微电子有限责任公司
Erfinder WITTMANN FRIEDER
K·贝亚尔
BEART KARIN
J·博克
BOCK JOHANNES
T·施密特
SCHMIDT THOMAS
B·舒赫
SCHUCH BERNHARD
F·维特曼
Vertreter 上海华诚知识产权代理有限公司 31300
Prioritätsdaten 102015217576 15.09.2015 DE
Titel
(EN) MEDIA-TIGHT CONTROL DEVICE FOR A MOTOR VEHICLE AND METHOD FOR PRODUCING THE CONTROL DEVICE
(ZH) 用于机动车辆的对介质密封的控制装置和用于制造控制装置的方法
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Zusammenfassung
(EN) The invention relates to a control device in a motor vehicle, comprising: a housing cover (4) which has a peripheral edge region (8); a flat, electrical connecting device (2, 3) which has integrated conductive tracks, the housing cover (4) being materially bonded to the connecting device (2, 3) in the edge region (8) and forming a cavity (9) with the connecting device (2, 3); at least one electronic component (7) within the cavity (9), the connecting device (2, 3) electrically connecting the at least one electronic component (7) to electronic components outside of the cavity (9), wherein the housing cover (4) is overmolded with a polymer (5) in a media-tight manner beyond the peripheral edge region (8).
(ZH) 本发明涉及一种机动车辆中的控制装置，该控制装置包括：具有环绕的边缘区域(8)的壳体盖(4)；具有整合的导体轨道的平坦的电连接设备(2，3)，其中该壳体盖(4)在该边缘区域(8)中至少与该连接设备(2，3)材料配合地连接并且与该连接设备(2，3)构成空腔(9)；该空腔(9)之内的至少一个电子构件(7)，其中该连接设备(2，3)将该至少一个电子构件(7)与该空腔(9)之外的电子构件电连接，其中用聚合物(5)以对介质密封的方式超出该环绕的边缘区域(8)地包覆模制该壳体盖(4)。
Verwandte Patentdokumente
DE102015217576
EP3351068
JP2018530295
WO/2017/045854
US20180206355
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