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1. CN106462053 - Method and device for embossing a nanostructure

Amt
China
Aktenzeichen/Anmeldenummer 201480078179.0
Anmeldedatum 22.04.2014
Veröffentlichungsnummer 106462053
Veröffentlichungsdatum 22.02.2017
Erteilungsnummer 106462053
Erteilungsdatum 01.12.2020
Veröffentlichungsart B
IPC
G03F 7/00
GSektion G Physik
03Fotografie; Kinematografie; vergleichbare Techniken unter Verwendung von nicht optischen Wellen; Elektrografie; Holografie
FFotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen; Materialien dafür; Kopiervorlagen dafür; Vorrichtungen besonders ausgebildet dafür
7Fotomechanische, z.B. fotolithografische Herstellung von strukturierten oder gemusterten Oberflächen, z.B. Druckflächen; Materialien dafür, z.B. mit Fotolacken ; Vorrichtungen besonders ausgebildet dafür
CPC
G03F 7/0002
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
G03F 7/70783
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
70783Stress or warp of chucks, mask or workpiece, e.g. to compensate for imaging error
G03F 7/70733
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
B41F 19/02
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
FPRINTING MACHINES OR PRESSES
19Apparatus or machines for carrying out printing operations combined with other operations
02with embossing
Anmelder EV GROUP E THALLNER GMBH
EV 集团 E·索尔纳有限责任公司
Erfinder KREINDL GERALD
G.克赖因德尔
Vertreter 中国专利代理(香港)有限公司 72001
中国专利代理(香港)有限公司 72001
Titel
(EN) Method and device for embossing a nanostructure
(ZH) 用于压印纳米结构的方法和装置
Zusammenfassung
(EN) The present invention relates to a method and device for embossing a nanostructure (13) from a nanostructure stamp (5) into a stamp face (14) of a curable material (8) applied on a substrate (7) with the following steps, in particular in the following sequence: aligning the nanostructure (13) with respect to the stamp face (14), embossing the stamp face (14) by A) preloading the nanostructure stamp (5) by deforming the nanostructure stamp (5) and/or preloading the substrate (7) by deforming the substrate (7), B) contacting a partial area (15) of the stamp face (14) with the nanostructure stamp (5), and C) automatic contacting of the remaining area (16) at least partially, in particular predominantly, by the preloading of the nanostructure stamp (5) and/or the preloading of the substrate (7).
(ZH) 本发明涉及用于将纳米结构(13)从纳米结构压模(5)压印到施加到基体(7)上的、能够硬化的材料(8)的压模面(14)中的方法,具有下列步骤、尤其下列过程:相对于所述压模面(14)对齐所述纳米结构(13),通过如下方式压印所述压模面(14)A)通过所述纳米结构压模(5)的变形来预紧所述纳米结构压模(5)和/或通过所述基体(7)的变形来预紧所述基体(7),B)所述压模面(14)的部分面(15)与所述纳米结构压模(5)接触,以及C)至少部分地、尤其主要地,通过预紧所述纳米结构压模(5)和/或预紧所述基体(7)自动接触所述其余面(16)。