(EN) The present invention relates to a method and device for embossing a nanostructure (13) from a nanostructure stamp (5) into a stamp face (14) of a curable material (8) applied on a substrate (7) with the following steps, in particular in the following sequence: aligning the nanostructure (13) with respect to the stamp face (14), embossing the stamp face (14) by A) preloading the nanostructure stamp (5) by deforming the nanostructure stamp (5) and/or preloading the substrate (7) by deforming the substrate (7), B) contacting a partial area (15) of the stamp face (14) with the nanostructure stamp (5), and C) automatic contacting of the remaining area (16) at least partially, in particular predominantly, by the preloading of the nanostructure stamp (5) and/or the preloading of the substrate (7).
(ZH) 本发明涉及用于将纳米结构(13)从纳米结构压模(5)压印到施加到基体(7)上的、能够硬化的材料(8)的压模面(14)中的方法,具有下列步骤、尤其下列过程:相对于所述压模面(14)对齐所述纳米结构(13),通过如下方式压印所述压模面(14)A)通过所述纳米结构压模(5)的变形来预紧所述纳米结构压模(5)和/或通过所述基体(7)的变形来预紧所述基体(7),B)所述压模面(14)的部分面(15)与所述纳米结构压模(5)接触,以及C)至少部分地、尤其主要地,通过预紧所述纳米结构压模(5)和/或预紧所述基体(7)自动接触所述其余面(16)。