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1. CN104583451 - Method of coating by pulsed bipolar sputtering

Amt
China
Aktenzeichen/Anmeldenummer 201380034551.3
Anmeldedatum 28.06.2013
Veröffentlichungsnummer 104583451
Veröffentlichungsdatum 29.04.2015
Veröffentlichungsart A
IPC
C23C 14/06
CSektion C Chemie; Hüttenwesen
23Beschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Chemische Oberflächenbehandlung; Diffusionsbehandlung von metallischen Werkstoffen; Beschichten allgemein durch Vakuumbedampfen, Aufstäuben, Ionenimplantation oder chemisches Abscheiden aus der Dampfphase; Inhibieren von Korrosion metallischer Werkstoffe oder von Verkrustung allgemein
CBeschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Oberflächenbehandlung metallischer Werkstoffe durch Diffusion in die Oberfläche, durch chemische Umwandlung oder Substitution; Beschichten allgemein durch Vakuumbedampfen, durch Aufstäuben, durch Ionenimplantation oder durch chemisches Abscheiden aus der Dampfphase
14Beschichten durch Vakuumbedampfen, durch Aufstäuben oder durch Ionenimplantation des Beschichtungsmaterials
06gekennzeichnet durch das Beschichtungsmaterial
H01J 37/34
HSektion H Elektrotechnik
01Grundlegende elektrische Bauteile
JElektrische Entladungsröhren oder Entladungslampen
37Entladungsröhren mit Vorkehrung zum Einführen von Gegenständen oder Werkstoffen, die der Entladung ausgesetzt werden sollen, z.B. zur Prüfung oder Bearbeitung derselben
32Gasgefüllte Entladungsröhren
34mit Kathodenzerstäubung arbeitend
C23C 14/34
CSektion C Chemie; Hüttenwesen
23Beschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Chemische Oberflächenbehandlung; Diffusionsbehandlung von metallischen Werkstoffen; Beschichten allgemein durch Vakuumbedampfen, Aufstäuben, Ionenimplantation oder chemisches Abscheiden aus der Dampfphase; Inhibieren von Korrosion metallischer Werkstoffe oder von Verkrustung allgemein
CBeschichten metallischer Werkstoffe; Beschichten von Werkstoffen mit metallischen Stoffen; Oberflächenbehandlung metallischer Werkstoffe durch Diffusion in die Oberfläche, durch chemische Umwandlung oder Substitution; Beschichten allgemein durch Vakuumbedampfen, durch Aufstäuben, durch Ionenimplantation oder durch chemisches Abscheiden aus der Dampfphase
14Beschichten durch Vakuumbedampfen, durch Aufstäuben oder durch Ionenimplantation des Beschichtungsmaterials
22gekennzeichnet durch das Beschichtungsverfahren
34durch Aufstäuben
CPC
C23C 14/0623
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
0623Sulfides, selenides or tellurides
C23C 14/345
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3435Applying energy to the substrate during sputtering
345using substrate bias
C23C 14/3485
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3485using pulsed power to the target
H01J 37/3467
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3464Operating strategies
3467Pulsed operation, e.g. HIPIMS
C23C 14/0629
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
0623Sulfides, selenides or tellurides
0629of zinc, cadmium or mercury
C23C 14/3407
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3407Cathode assembly for sputtering apparatus, e.g. Target
Anmelder OERLIKON ADVANCED TECHNOLOGIES AG
Erfinder ELGHAZZALI MOHAMED
WEICHART JUERGEN
Vertreter cang yongjie liu chunyuan
Prioritätsdaten 61/666112 29.06.2012 US
Titel
(EN) Method of coating by pulsed bipolar sputtering
(ZH) 通过脉冲双极溅射的涂覆方法
Zusammenfassung
(EN) The present invention concerns a method of pulsed bipolar sputtering, the method comprising the steps of: applying a sputtering pulse (-) during a first period of time (T-) / and applying a reverse voltage pulse during a subsequent second period of time (T+). The step of applying the reverse voltage pulse comprises controlling, in particular adjusting, the timing of the reverse voltage pulse (T+). This way high quality sputtering is achieved, in particular for sputtering temperature sensitive materials.
(ZH)

本发明涉及脉冲双极溅射的方法,所述方法包括以下步骤:-在第一时间段(T-)期间应用溅射脉冲(-)/和-在随后的第二时间段(T+)期间应用反转电压脉冲。应用反转电压脉冲的步骤包括控制、特别是调整反转电压脉冲的定时(T+)。这样,实现了高质量溅射,特别是用于溅射温度敏感的材料。


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