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1. (WO2018087807) SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/087807    International Application No.:    PCT/JP2016/083068
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Wed Nov 09 00:59:59 CET 2016
IPC: H01L 21/283
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: NAKANO, Seiya
中野 誠也
Title: SEMICONDUCTOR DEVICE
Abstract:
The invention comprises: a surface metal formed on a base board; a first protective film formed on the surface metal; a second protective film transparent to light, and having a first section disposed on the first protective film, and a second section connected to the first section and disposed on the surface metal; and a metal film having a main body section disposed on the surface metal, and an overlapping section connected to the main body section and overlapping the first protective film. The main body section is thicker than the first protective film, the first section is thicker than the stacking-over section, and the second section is thicker than the main body section.