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1. (US20060252336) Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding

المكتب : الولايات المتحدة الأمريكية
رقم الطلب: 11409410 تاريخ الطلب: 20.04.2006
رقم النشر: 20060252336 تاريخ النشر: 09.11.2006
رقم التسليم: 7677943 تاريخ التسليم: 16.03.2010
نوع النشر: B2
التصنيف الدولي للبراءات:
H05B 33/10
F21K 7/00
H01L 25/075
H01L 51/50
H01L 51/56
H05B 33/00
H05B 33/14
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المتقدمون: Articulated Technologies, LLC
المخترعون: Daniels John J.
Nelson Gregory V.
الوكلاء: Michaud-Kinney Group LLP
بيانات الأولوية:
العنوان: (EN) Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding
الملخص: front page image
(EN)

A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.