البحث في مجموعات البراءات الوطنية والدولية

1. (WO2018042892) ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Pub. No.:    WO/2018/042892    International Application No.:    PCT/JP2017/025277
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Wed Jul 12 01:59:59 CEST 2017
IPC: G03F 7/039
C08F 220/28
G03F 7/20
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: HATAKEYAMA Naoya
畠山 直也
YONEKUTA Yasunori
米久田 康智
FUKUHARA Toshiaki
福原 敏明
TOMIGA Takamitsu
冨賀 敬充
YOSHINO Fumihiro
吉野 文博
Title: ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition which enables accurate performance evaluation of a resist pattern obtained from a thick resist film; an active light sensitive or radiation sensitive film; a pattern forming method; and a method for manufacturing an electronic device. This active light sensitive or radiation sensitive resin composition contains a resin that has a repeating unit having an alkyleneoxy chain and a repeating unit having an aromatic group, and has a solid content concentration of 10% by mass or more. This pattern forming method has (i) a step for forming an active light sensitive or radiation sensitive film having a film thickness of 1 μm or more on a substrate with use of an active light sensitive or radiation sensitive resin composition which contains a resin that has a repeating unit having an alkyleneoxy chain.