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Results 1-10 of 6,163 for Criteria: Office(s):all Language:FR Stemming: true maximize
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NoCtrTitlePubDateInt.ClassAppl.NoApplicantInventor
1. WOWO/2014/204397 - PACKAGE MATERIAL COMPRISING A TEARING LINE24.12.2014
B65D 75/42
PCT/SG2013/000248NESTEC S.A.SOH, Hock Seng Gordon
The present invention relates to a package material comprising at least one tearing line which comprises a number of perforation cuts characterized in that the continuous projection of the cutting line of each of the perforation cuts points- from each end of a perforation cut into a middle section of another perforation cut that is the immediate adjacent next perforation cut to that end within the tearing line. Particularly, the present invention pertains to a package material in the form of a chain of flexible sachets separated each by the tearing line for use of packaging a food product.

2. WOWO/2014/204398 - AN AC SOLAR MODULE24.12.2014
H01L 31/042
PCT/SG2013/000250LEAW, Kok BengLEAW, Kok Beng
A micro inverter (202) for a solar panel (204) comprising: at least two input terminals (210), each terminal configured to directly engage an output terminal (208) engaged directly with a terminal bus bar (302, 304) of the solar panel (204); a mounting bracket (502) configured to directly couple to a frame of the solar panel (204); wherein the input terminals (210) are configured to align directly with the output terminals (208) and thereby from an electrical connection when the mounting bracket is coupled to the frame without any electrical cabling or electrical connectors.

3. WOWO/2014/204399 - AN APPARATUS FOR GENERATING NANOBUBBLES24.12.2014
B01F 5/00
PCT/SG2013/000503GOI, Lai HuatGOI, Lai Huat
An apparatus (10) for generating nanobubbles for use with fluid dispensing fittings is described. The apparatus includes a longitudinal shaft having a first end portion (12), a body (16) and a second end portion (14). The first end portion (12) and the second end portion ( 14) are adapted for connection with the body (16). The first end portion (12) and the second end portion (14) each includes a conical-shaped guide wherein the body comprises airfoil- shaped projecting members (19) arranged circumferentially on the outer circumferential surface of the body (16).

4. WOWO/2014/204404 - INTELLIGENT MOBILE DATA OFFLOADING24.12.2014
H04W 48/18
PCT/SG2014/000287ADVANCED NETWORK TECHNOLOGY LABORATORIES PTE LTDTEO, Wee Tuck
A method for offloading mobile data may include determining a micro-cell performance parameter associated with a micro-cell of a mobile communication system. Further, the method may include determining whether to offload mobile data operations to a micro-cell access point that corresponds to the micro-cell based on the micro-cell performance parameter.

5. WOWO/2014/204403 - THIN FILM COMPOSITE HOLLOW FIBERS FOR OSMOTIC POWER GENERATION24.12.2014
B01D 69/08
PCT/SG2014/000286NATIONAL UNIVERSITY OF SINGAPOREZHANG, Sui
Disclosed is a thin film composite hollow fiber that includes an outer support layer having a thickness of 10 to 10000 µm and a polyamide thin film layer having a thickness of 1 to 10000 nm; and has a transmembrane pressure resistance rate of higher than 15 bar and a pure water permeability rate of higher than 0.8 Lm-2h-1bar-1. Also disclosed are methods of preparing the above-described support and composite hollow fiber.

6. WOWO/2014/204401 - PROTECTIVE STRUCTURE FOR THROUGH-SILICON-VIA24.12.2014
H01L 23/34
PCT/SG2014/000277AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHLI, Hong Yu
A method for reducing thermal stress around a through-silicon-via (TSV) for a 3D integrated circuit package is provided. The method includes fabricating a protective structure around the TSV before fabricating the TSV, the protective structure comprising along a height of the TSV at least one first portion and at least one second portion, each of the at least one first portion having a first portion structure thickness measured radially from the TSV less than a second portion structure thickness of the each of the at least second portion which is also measured radially from the TSV while the radial distance of corresponding ones of the at least one first portion and the at least one second portion measured from the TSV to the centres of the at least one first portion and the at least one second portion is substantially equal.

7. WOWO/2014/204402 - SURFACE MODIFICATION OF MEDICAL OR VETERINARY DEVICES24.12.2014
C08B 37/12
PCT/SG2014/000283NATIONAL UNIVERSITY OF SINGAPORELI, Min
The invention concerns a medical or veterinary device comprising a covalently immobilized and cross-linked agarose coating, a method for the production of same and a cross-linked agarose coating.

8. WOWO/2014/204405 - METHOD FOR MODULATING RECOMBINANT PROTEIN PRODUCTION24.12.2014
C12N 15/113
PCT/SG2014/000289AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHLOH, Wan Ping
The present disclosure is based on the use of miRNAs (miR-17, miR-19b, miR-20a, miR-92a, miR-18a and miR-19a) for modulating recombinant protein production in a cell line in order to increase the productivity and titer of a recombinant protein. Moreover, the present disclosure provides expression systems and kits for modulating a recombinant protein production in a cell line.

9. WOWO/2014/204407 - SURFACE MODIFICATION24.12.2014
A61L 31/08
PCT/SG2014/000291NATIONAL UNIVERSITY OF SINGAPOREWANG, Rong
We disclose a novel composition for modifying the surfaces of, for example, medical devices such as catheters, stents, cannulas or other narrow tubing, to prevent bacterial infections and encrustations.

10. WOWO/2014/204400 - SYSTEM AND METHOD FOR DESIGNING AN INTEGRATED CIRCUIT24.12.2014
G06F 17/50
PCT/SG2014/000224PLUNIFY PTE LTDNG, Harn Hua
A system and method are provided for compiling an integrated circuit design are described. A web-based client accessible from a personal computer provides access for a user to a network- based server where the user is able to provide an integrated circuit design for compilation. The system propagates values into pertinent parameters for compilation of the circuit design, and further, provides strategies and suggestions based on analysis of past results for propagating values for a plurality of compilation sequences. Compilation of the integrated circuit design is carried out on server-based computing resources by way of parallel compilation of the plurality of compilation sequences, allowing for concurrent time-saving operation.


Results 1-10 of 6,163 for Criteria: Office(s):all Language:FR Stemming: true
préc. 1 2 3 4 5 6 7 8 9 10 suiv.